Multilayer Printed Circuit Interconnection Techniques

Abstract

Proponents of the various miniaturization techniques claim advantages of: reduced size, weight and cost, and increased reliability. Reduction in size and weight are obvious consequences of the technique. Reduced cost and improved reliability are still to be proven. Shrinking electronic assemblies and sub-assemblies bring about interconnection problems to the packaging engineer. Interconnecting devices are not only a factor in weight and size, but are a weak link in the reliability chain of the complete electronic system. These matters are considered in this report with especial attention to multilayer printed circuit boards.