Millimeter-wave packaging

Abstract

The authors reviewed the state of the art in millimeter-wave packaging and analyzed its potentials and limitations. Based on the analysis of the requirements and technology development, the following trends can be expected for millimeter-wave packages: (1) packaging at higher levels of integration-the advent of millimeter-wave multichip packages; (2) the substantially increased use of electromagnetic simulation design tools; (3) the introduction of new materials and processes, for example AlN and cofired ceramic techniques; (4) the integration of a considerably higher complexity and multiplicity of electronic functions within the package envelope; and (5) a substantial reduction in the size, weight, and cost of millimeter-wave packages.<>