AC Breakdown Performance of Non-isothermally Crystallized Polyethylene/Silicon Nitride Nanocomposites

S. Kamarudin, K. Y. Lau, N. H. Rahim, C. Tan, W. Rahman
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Abstract

Polymer nanocomposites has a huge potential to serve as dielectric materials. These materials were found to have a great capability in withstanding high voltage levels. In nanocomposites development, the breakdown strength of the materials was often reported to be higher, lower or similar, in comparison with the unfilled polymer. Because of this, the breakdown performance of nanocomposites is said to be dependent not only on the polymer/nanofiller combination, but also on the sample preparation techniques. Unfortunately, factors leading to increased or decreased the breakdown strength of nanocomposites are less understood. In this paper, investigation into polyethylene blend systems that contain different amounts of silicon nitrite nanofiller with different non-isothermal crystallization processes was reported. The non-isothermal crystallization techniques were determined by fast, medium and slow cooling rate conditions while preparing the samples. Differential scanning calorimetry (DSC) was used to characterize the thermal behavior of the polymer nanocomposites. The AC breakdown data showed that the use of different non-isothermal crystallization techniques affected the AC breakdown strength of each material type.
非等温结晶聚乙烯/氮化硅纳米复合材料的交流击穿性能
聚合物纳米复合材料作为介电材料具有巨大的潜力。人们发现这些材料在承受高电压水平方面具有很强的能力。在纳米复合材料的发展中,与未填充的聚合物相比,材料的击穿强度经常被报道为更高、更低或相似。因此,纳米复合材料的击穿性能不仅取决于聚合物/纳米填料的组合,还取决于样品制备技术。不幸的是,导致纳米复合材料击穿强度增加或减少的因素尚不清楚。本文研究了含不同亚硝酸硅纳米填料的聚乙烯共混体系和不同的非等温结晶过程。制备样品时,采用快、中、慢三种冷却速率对非等温结晶技术进行了测定。采用差示扫描量热法(DSC)表征了聚合物纳米复合材料的热行为。交流击穿数据表明,使用不同的非等温结晶技术会影响每种材料类型的交流击穿强度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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