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An approach to optimize manufacturing of a compact transimpedance amplifier based on heterostructures to increase density of their elements. Influence of mismatch induced stress and porosity of materials on technological process

International Journal of Electronic Devices and Networking Pub Date : 2022-01-01 DOI:10.22271/27084477.2022.v3.i1a.20
E. Pankratov
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一种基于异质结构的紧凑型跨阻放大器的优化制造方法，以提高其元件的密度。错配诱导应力和材料孔隙率对工艺过程的影响
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International Journal of Electronic Devices and Networking
International Journal of Electronic Devices and Networking
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