Simulation Study of Thermo-Mechanical Properties of Power Transistor Embedded in PCB

A. Chvála, J. Marek, A. Šatka, J. Chen
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Abstract

Thermo-mechanical simulation study of a power transistor embedded in a printed circuit board (PCB) is presented. The analysis is focused on the optimization of the design to improve the thermal and mechanical reliability performance of the system. Numerical simulations are effectively used in the identification of critical areas in the systems using power transistors embedded in the PCB, and their optimization with respect to lower mechanical strain and better heat transfer, both leading to improved reliability of the final system.
嵌入式PCB中功率晶体管热力学性能的仿真研究
对嵌入式印刷电路板(PCB)中的功率晶体管进行了热力学仿真研究。分析的重点是优化设计,以提高系统的热可靠性和机械可靠性。数值模拟有效地应用于PCB内嵌功率晶体管系统中关键区域的识别,并对其进行优化,以降低机械应变和更好的传热,从而提高最终系统的可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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