3-dimensional memory module assembly technology

Abstract

In order to meet the demand for higher density and greater capacity, a three dimensional memory module has been developed. NEC has developed a new type of 3D memory module which uses single memory module stacking technology. It satisfies the demands for higher packaging density using a simple structure. The reliability of the single memory modules and 3D memory module was tested using 16 Mb DRAM chips. The results suggest that our 3D memory modules have good reliability. With our dual in-line memory modules (DIMM), no breaks in the solder bonds between single memory modules and motherboard were observed over 3000 cycles of thermal cycling testing.