B. Hinkov, H. Hoang, D. Ristanić, M. Hugues, J. Chauveau, G. Strasser
{"title":"Fabrication and surface-leakage suppression in (non-polar) m-Zn(Mg)O optoelectronic devices","authors":"B. Hinkov, H. Hoang, D. Ristanić, M. Hugues, J. Chauveau, G. Strasser","doi":"10.1117/12.2584830","DOIUrl":null,"url":null,"abstract":"Zincoxide is a rather new material system and promising candidate for mid-infrared (mir) and THz optoelectronic devices like quantum cascade lasers (QCLs) and detectors (QCDs) due to its twice as high LO-phonon energy as GaAs. The non-polar m-plane orientation allows designing and realizing such complex devices without internal electrical fields.\nWe present the full fabrication scheme of such QCL/QCD devices including novel optimized etching techniques, surface leakage current suppression by multiple orders of magnitude and low resistance Ohmic contacts (~10^(-5) Ohm x cm^2). Optimized fabrication schemes resulted in fabrication yielding up to more than 80% of operational devices.","PeriodicalId":296935,"journal":{"name":"Oxide-based Materials and Devices XII","volume":"59 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Oxide-based Materials and Devices XII","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2584830","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Zincoxide is a rather new material system and promising candidate for mid-infrared (mir) and THz optoelectronic devices like quantum cascade lasers (QCLs) and detectors (QCDs) due to its twice as high LO-phonon energy as GaAs. The non-polar m-plane orientation allows designing and realizing such complex devices without internal electrical fields.
We present the full fabrication scheme of such QCL/QCD devices including novel optimized etching techniques, surface leakage current suppression by multiple orders of magnitude and low resistance Ohmic contacts (~10^(-5) Ohm x cm^2). Optimized fabrication schemes resulted in fabrication yielding up to more than 80% of operational devices.