Computational Fluid Dynamic Analysis of Thermal Characteristics on the PLCC Package: Influence of velocity and heat flux

Abstract

Thermal management is essential in electronic components and devices. Overheating of the component leads to malfunction. This study investigates the effects of velocity and heat flux on the Plastic Leaded Chip Carrier (PLCC) during the thermal cooling process via simulation analysis. Computational fluid dynamics software simulated the cooling process of PLCC. The size of the PLCC used is 2.72 cm × 2.72 cm × 0.38 cm. The effect of heat flux and velocity on temperature distribution, flow pattern, and pressure distribution was studied. The findings indicated that as the approach air velocity increased, the temperature of the packages decreased. The result also shows that the static pressure decrease along with the package when the air velocity increases. The simulation results are expected to understand better the cooling process of PLCC in the thermal management of electronic components and devices.