A study of mechanical properties of multi-layered thin films [for MEMS]

Abstract

It is of great importance to investigate mechanical properties of a multi-layered thin film in designing and realizing micro-electro-mechanical systems (MEMS). A new tensile test method is proposed to measure mechanical properties of a multi-layered thin film, which are used in MEMS. In this method, we develop a prefabricated test substrate of gage portion. After measuring Young's modulus of prefabricated test substrate, a thin film is deposited on the test substrate and tensile test is carried out. Young's modulus of the thin film can be measured by subtracting the effect of Young's modulus of the prefabricated test substrate. As an example, Young's modulus of a tungsten thin film deposited by sputtering is measured. We discuss the viability of this method for measuring the mechanical properties of deposited thin film.