Optimization of fabrication processes of the mesa-type GaAs:Te blocked-impurity-band detector

Abstract

In this work, the device structure of the mesa-type GaAs:Te blocked-impurity-band detector was designed. The fabrication processes were presented briefly, and optimization of the fabrication processes was investigated. A 3-micron-thick SiO2 film was deposited as resist to substitute for photoresist in the 50-micron-deep mesa etching process. In addition, a bi-layer photoresist lithography technique was adopted to optimize the process of electrode fabrication. It is demonstrated that the device quality can be improved significantly after optimization.