Design of Antenna-in-Package in 5G Communication Band Based on LTCC Technology

Zhang Xiaoqing, Liu Dexi, Zhuo Dalong, S. Lei
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Abstract

Antenna-in-Package(AiP) technology has an advantage that a system can maintain antenna performance while being small in size and highly integrated. In this paper, based on LTCC technology, a rectangular corner cut microstrip antenna for 5G communication band is designed, and then integrated into a package of the chip with AiP technology. The simulation results of HFSS software show that after miniaturized and highly integrated, the AiP system achieves the goal with operation frequency of 4.8 ~ 4.9GHz, bandwidth of 100MHz and the peak gain of 6.52dB.
基于LTCC技术的5G通信频段封装天线设计
封装天线(antenna -in- package, AiP)技术的优点是在系统体积小、集成度高的同时,还能保持天线的性能。本文基于LTCC技术,设计了一种5G通信频段的矩形切角微带天线,并采用AiP技术集成到芯片封装中。HFSS软件仿真结果表明,经过小型化和高度集成化后,AiP系统达到了工作频率4.8 ~ 4.9GHz、带宽100MHz、峰值增益6.52dB的目标。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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