Moving Beyond S-Parameter Files: Advanced Scalable and 3D EM Models for Passive Devices

Abstract

S-parameter data files remain the most commonly available “model” for representing passive devices in the microwave industry. As exemplified herein, physically-motivated equivalent circuit models can be setup to scale accurately with part-value, substrate properties and other parameters, such as solder pad dimensions. While powerful and enabling, these globally scalable circuit models cannot generally account for electromagnetic coupling interactions between components and between components and their surroundings. Consequently, full-wave Electromagnetic (EM) analysis has become a crucial step for radio frequency (RF) design in order to account for interactions between components and between components and their shielding and interconnect environment. However, such models often require access to proprietary component composition details. A solution to these challenges is described in the form of IP-encrypted 3D model libraries. These libraries use technology recently available in some EM simulators, for encrypting geometry and material details to protect vendor manufacturing IP. This advance enables 3D EM models to be shared with a wider design community, helping designers reduce design risk and re-work and improve time-to-market for today’s increasingly compact and complex product form factors.