Integrated power packaging: trends, driving forces, and restraints

Abstract

Movement toward integrated power packaging has been occurring for well over a decade. In the past few years in particular, with growing interest in value added and the attention being paid to true system cost, integrated power packaging is broadening in appeal in all major market segments. This approach competes with the traditional discrete component solutions. This paper reviews trends that are contributing to this growing interest and forces pushing for implementation. Also, obstacles inhibiting realization are explored.