Component performance advantages realized through thermoplastic encapsulation

Abstract

Thermoplastic encapsulation of electrical and electromechanical devices continues to yield improvements in cost, performance, and environmental sealing. The use of an injection molding process enables traditional advantages of part consolidation and cost reduction via integration of mounting components, termination features, and total cycle times of 20 to 60 seconds. With the use of thermally conductive thermoplastics, advances are being realized in thermal dissipation, particulate emissions, the reduction of both structural and audible vibration, and electrical circuit encapsulation. This paper reviews these developments.