Improvement of the high temperature oxidation resistance and anti-arc erosion of pure Cu with the addition of La and graphite

Hai-yan Li, Yaping Wang, Xue-qiong Lu, Xuan Zhou
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引用次数: 3

Abstract

The effect of La and graphite additives on the oxidation resistance and arc erosion behavior of Cu alloys were studied. The pure Cu was completely oxidized to be Cu2O and CuO at 1000° for 1h, whereas the CuLa/C was partially oxidized. The reinforced phase graphite suppressed the formation of continuous copper oxide films. The formation of compact barrier layer of CuLa/C alloy was helpful for preventing the in-diffusion of the oxygen and was very effective in reducing the oxidation rate of the CuLa/C alloy. The resistance of pure copper was lower than that of CuLa/C alloy by EIS analysis. It was due to the electrolyte penetrated into the porous oxide film and decreased the resistance of oxide film of pure copper. Furthermore, The CPE-P of CuLa/C alloy was less than that of the pure copper, indicating the oxide film of CuLa/C alloy is more compact. After 5000 operations, the surface of pure Cu contacts were oxidized and eroded seriously, results in a marked increase in contact resistance and temperature rise. While contact resistance and temperature rise of CuLa/C contacts remained relatively stable. In the presence of an arc, the graphite combined with oxygen in the air or of the CuLa/C contacts, to form carbon oxide and carbon dioxide, emission of which can dissipate arc heat away from the contacts and reduce the surface temperature. Therefore, the addition of La and graphite improve the arc erosion resistance of Cu-based contacts.
添加La和石墨提高纯Cu的高温抗氧化性和抗电弧侵蚀性能
研究了镧和石墨添加剂对Cu合金抗氧化性能和电弧侵蚀性能的影响。纯Cu在1000℃下氧化1h完全氧化为Cu2O和CuO, cua /C部分氧化。增强相石墨抑制了连续氧化铜膜的形成。在cua /C合金中形成致密的阻挡层有助于防止氧的扩散,对降低cua /C合金的氧化速率非常有效。EIS分析表明,纯铜的电阻低于CuLa/C合金的电阻。这是由于电解液渗透到多孔氧化膜中,降低了纯铜氧化膜的电阻。此外,CuLa/C合金的CPE-P小于纯铜,表明CuLa/C合金的氧化膜更加致密。经过5000次操作后,纯铜触点表面氧化侵蚀严重,触点电阻明显升高,温度升高。而CuLa/C触点的接触电阻和温升保持相对稳定。在电弧存在的情况下,石墨与空气中的氧气或CuLa/C触点结合,形成一氧化碳和二氧化碳,其排放可以从触点散发电弧热量并降低表面温度。因此,镧和石墨的加入提高了铜基触点的抗电弧侵蚀能力。
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