Experimental verification of signal integrity deterioration due to package-common-mode resonance

Abstract

When an LSI package is mounted on a PCB, parasitic couplings are unintentionally generated between them. Antiresonance of these couplings (package-common-mode resonance) can cause degradation of signal and power integrity. In this paper, the authors experimentally verified the package-common-mode resonance by comparing scattering parameters with variation of CMOS output jitter. In order to suppress increase of the jitter, resister-dumping method was tested as a countermeasure.