High performance CMOS fabricated on hybrid substrate with different crystal orientations

M. Yang, M. Ieong, L. Shi, K. Chan, V. Chan, A. Chou, E. Gusev, K. Jenkins, D. Boyd, Y. Ninomiya, D. Pendleton, Y. Surpris, D. Heenan, J. Ott, K. Guarini, C. D'Emic, M. Cobb, P. Mooney, B. To, N. Rovedo, J. Benedict, R. Mo, H. Ng
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引用次数: 99

Abstract

A novel structure and technology has been developed for high performance CMOS using hybrid silicon substrates with different crystal orientations (namely pFET on [110]-oriented surface and nFET on (100) surface) through wafer bonding and selective epitaxy. CMOS devices with physical gate oxide thickness of 1.2 nm have been demonstrated, with substantial enhancement of pFET drive current at L/sub poly//spl les/80 nm.
在不同晶体取向的混合衬底上制备高性能CMOS
采用不同晶体取向的混合硅衬底(即fet在[110]取向表面和net在[100]表面),通过晶圆键合和选择性外延,开发了一种新的结构和技术,用于高性能CMOS。在L/sub poly//spl les/80 nm处,pet驱动电流显著增强,物理栅极氧化物厚度为1.2 nm的CMOS器件已被证明。
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