Hierarchical electromigration reliability diagnosis for VLSI interconnects

Abstract

In this paper, we present a hierarchical reliability-driven CAD system for the design of electromigration resistant circuits. The top of the hierarchy aims at quickly identifying those critical interconnects with potential electromigration reliability problems. Then the detailed electromigration analysis of critical interconnects is carried out by an accurate and computationally efficient simulation tool (ITEM). This top-down approach provides a feasible solution to the complicated electromigration diagnosis problem.