Deformable Chiplet-Based Computer Using Inductively Coupled Wireless Communication

J. Kadomoto, H. Irie, S. Sakai
{"title":"Deformable Chiplet-Based Computer Using Inductively Coupled Wireless Communication","authors":"J. Kadomoto, H. Irie, S. Sakai","doi":"10.1109/asp-dac52403.2022.9712494","DOIUrl":null,"url":null,"abstract":"Research on microrobot swarms and deformable user interfaces has been conducted extensively. Inductively coupled wireless bus technology has been proposed for such applications. This technology uses inductive coupling among on-chip coils to connect multiple chiplets wirelessly. By wirelessly connecting small chiplets, it is possible to construct deformable systems with various chip configurations. The prototype chip, which has a 32-bit RISC-V processor core and a wireless communication interface, is fabricated in 1.18-µm CMOS technology. The prototype validates that inductively coupled wireless data communication can be achieved between two processor chiplets.","PeriodicalId":239260,"journal":{"name":"2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"118 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-01-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/asp-dac52403.2022.9712494","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Research on microrobot swarms and deformable user interfaces has been conducted extensively. Inductively coupled wireless bus technology has been proposed for such applications. This technology uses inductive coupling among on-chip coils to connect multiple chiplets wirelessly. By wirelessly connecting small chiplets, it is possible to construct deformable systems with various chip configurations. The prototype chip, which has a 32-bit RISC-V processor core and a wireless communication interface, is fabricated in 1.18-µm CMOS technology. The prototype validates that inductively coupled wireless data communication can be achieved between two processor chiplets.
基于感应耦合无线通信的可变形芯片计算机
微机器人群体和可变形用户界面的研究已经得到了广泛的开展。电感耦合无线总线技术已被提出用于此类应用。该技术使用片上线圈之间的电感耦合以无线方式连接多个芯片。通过无线连接小芯片,可以构建具有各种芯片配置的可变形系统。该原型芯片采用1.18µm CMOS技术制造,具有32位RISC-V处理器核心和无线通信接口。该原型验证了两个处理器芯片之间可以实现感应耦合无线数据通信。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信