Image quality testing of assembled IR camera modules

D. Winters, P. Erichsen
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Abstract

Infrared (IR) camera modules for the LWIR (8-12_m) that combine IR imaging optics with microbolometer focal plane array (FPA) sensors with readout electronics are becoming more and more a mass market product. At the same time, steady improvements in sensor resolution in the higher priced markets raise the requirement for imaging performance of objectives and the proper alignment between objective and FPA. This puts pressure on camera manufacturers and system integrators to assess the image quality of finished camera modules in a cost-efficient and automated way for quality control or during end-of-line testing. In this paper we present recent development work done in the field of image quality testing of IR camera modules. This technology provides a wealth of additional information in contrast to the more traditional test methods like minimum resolvable temperature difference (MRTD) which give only a subjective overall test result. Parameters that can be measured are image quality via the modulation transfer function (MTF) for broadband or with various bandpass filters on- and off-axis and optical parameters like e.g. effective focal length (EFL) and distortion. If the camera module allows for refocusing the optics, additional parameters like best focus plane, image plane tilt, auto-focus quality, chief ray angle etc. can be characterized. Additionally, the homogeneity and response of the sensor with the optics can be characterized in order to calculate the appropriate tables for non-uniformity correction (NUC). The technology can also be used to control active alignment methods during mechanical assembly of optics to high resolution sensors. Other important points that are discussed are the flexibility of the technology to test IR modules with different form factors, electrical interfaces and last but not least the suitability for fully automated measurements in mass production.
组合红外相机模块的图像质量测试
用于LWIR (8-12_m)的红外(IR)相机模块将红外成像光学器件与带有读出电子器件的微测热计焦平面阵列(FPA)传感器相结合,正成为越来越多的大众市场产品。与此同时,在高价市场上,传感器分辨率的稳步提高提高了对物镜成像性能的要求,以及物镜和FPA之间的适当对准。这给摄像机制造商和系统集成商带来了压力,他们必须以一种成本效益高、自动化的方式评估成品摄像机模块的图像质量,以便进行质量控制或在生产线末端进行测试。本文介绍了红外相机模组图像质量检测领域的最新研究进展。与传统的测试方法(如最小可分辨温差(MRTD))相比,该技术提供了丰富的附加信息,而传统的测试方法只能给出主观的总体测试结果。可以测量的参数是通过宽带或各种带通滤波器的调制传递函数(MTF)测量的图像质量,以及有效焦距(EFL)和失真等光学参数。如果相机模块允许光学元件重新对焦,则可以描述其他参数,如最佳对焦平面,图像平面倾斜,自动对焦质量,主射线角度等。此外,还可以对传感器的均匀性和响应进行表征,以便计算适当的非均匀性校正表。该技术还可用于控制光学元件与高分辨率传感器机械装配过程中的主动对准方法。讨论的其他要点是该技术的灵活性,以测试具有不同形状因素的IR模块,电气接口,最后但并非最不重要的是在大规模生产中完全自动化测量的适用性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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