Proposal for improvement the welding process of the micro- USB connector on the mother board on tablets

Journal of Engineering and Technology for Industrial Applications Pub Date : 1900-01-01 DOI:10.5935/2447-0228.20160014

Cristiano Mourão da Fonseca, Jandecy Cabral Leite, C. Freitas, António da Silva Vieira, R. Fujiyama

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引用次数: 3

Abstract

The current electrical and electronic products industry have features extremely dynamic and with constant search for improvement in their manufacturing processes, seeking greater efficiency and lower costs. In the manufacturing process of the main board on tablets, in the area of welding technology, there was a problem in the micro USB connector soldering process causing high defect rates. The purpose of this article was to conduct assessment and proposal for improvement in this process. The methods and techniques used were quality tools PDCA cycle, cause and effect diagram and 5W2H. Among these solutions, the choice was to implement pallets of durestone to maintain the alignment of the connector on the reflow soldering oven. The results show a reduction in failure rates from 12.40% to 0.09% in the production line, which avoided the institution generate a total of 24,800 defective boards on the total to be produced. The total cost savings from logistics repair of these boards was approximately 70.002,80. USD

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对平板电脑主板上微型USB接口焊接工艺的改进建议

当前的电气和电子产品行业具有极具活力的特点，并不断寻求改进其制造工艺，寻求更高的效率和更低的成本。在平板电脑主板的制造过程中，在焊接技术领域，微型USB连接器的焊接过程中出现了一个问题，导致缺陷率很高。本文的目的是对这一过程进行评估并提出改进建议。所采用的方法和技术有质量工具PDCA循环、因果关系图和5W2H。在这些解决方案中，选择是实施硬石托盘，以保持回流焊炉上连接器的对准。结果显示，生产线上的故障率从12.40%降至0.09%，避免了该机构在生产总量中产生24,800块次品板。这些电路板的后勤维修节省的总费用约为70.002,80。美元

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Engineering and Technology for Industrial Applications

CiteScore

0.60

自引率

0.00%

发文量