BestFit: a SPICE-compatible model for efficient, passive, broadband transmission-line analysis of dispersive interconnects

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI:10.1109/EPEP.2003.1250044

A. Woo, T. Yioultsis, A. Cangellaris

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引用次数: 3

Abstract

"BestFit" refers to a mathematical methodology used for the direct passive synthesis of SPICE-compatible models of multi-conductor interconnect structures. Given the bandwidth of simulation, the length of the interconnect system, and its per-unit-length, frequency-dependent resistance, inductance, capacitance and conductance matrices, the proposed algorithm synthesizes a compact, multi-port, dispersive, SPICE-compatible model for the interconnect. The resulting model is in terms of a concatenation of a number of non-uniform segments of lumped passive circuit representations of the per-unit-length series impedance and shunt admittance matrices, the lengths of which are obtained as a result of a Pade-Chebyshev approximation of the frequency-dependent input impedance matrix of the multiconductor transmission line system. The synthesized circuit is "optimal" in the sense that highly-accurate responses can be obtained with a number of segments per minimum wavelength barely exceeding the Nyquist limit of 2.

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BestFit:一个spice兼容模型，用于色散互连的高效、无源、宽带传输在线分析

“BestFit”是指用于多导体互连结构的spice兼容模型的直接被动合成的数学方法。考虑到仿真的带宽、互连系统的长度及其单位长度、频率相关的电阻、电感、电容和电导矩阵，该算法综合了一个紧凑、多端口、色散、spice兼容的互连模型。由此产生的模型是由单位长度串联阻抗和分流导纳矩阵的若干非均匀集总无源电路表示段串联而成的，其长度是由多导体传输线系统的频率相关输入阻抗矩阵的帕德-切比雪夫近似得到的。合成电路是“最优”的，因为每个最小波长的段数几乎不超过奈奎斯特极限2，就可以获得高精度的响应。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)

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