Characteristics of Triple Material Gate AlGaN/GaN High Electron Mobility Transistor

Md Tashfiq Bin Kashem, S. Subrina
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Abstract

A two dimensional simulation study has been executed to explore the characteristics of a newly proposed AlGaN/GaN High Electron Mobility Transistor (HEMT) device with triple material gate (TMG) structure. Surface potential and electric field distribution along the device channel are comprehensively examined and compared with those of dual material gate (DMG) and single material gate (SMG) HEMT. TMG HEMT shows better suppression of drain induced barrier lowering (DIBL) and hot carrier effect (HCE) due to the formation of two steps screening effect in channel potential and less amount of electric field peak at the drain terminal. Effect of different device parameters e.g. individual channel length related to different gate material, total channel length and externally applied voltage on the surface potential and electric field are also explored and proper choice of the device parameters and bias voltages is optimized to improve device performance, achieve high speed and reduce short channel effects (SCE) effectively.
三材料栅极AlGaN/GaN高电子迁移率晶体管的特性
采用二维仿真方法研究了一种新型三材料栅极(TMG)结构AlGaN/GaN高电子迁移率晶体管(HEMT)器件的特性。并与双材料栅极(DMG)和单材料栅极(SMG) HEMT的表面电位和沿器件通道的电场分布进行了比较。TMG HEMT对漏极势垒降低(DIBL)和热载子效应(HCE)有较好的抑制作用,这是由于通道电位形成了两级筛选效应,漏极端的电场峰量较少。探讨了不同器件参数(如与不同栅极材料相关的单个沟道长度、总沟道长度、外加电压对表面电位和电场的影响)对器件性能的影响,优化了器件参数和偏置电压的合理选择,从而有效地提高了器件性能,实现了高速率,有效地减少了短沟道效应(SCE)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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