{"title":"Wideband Multi-wavelength True Time Delay Component with High integration","authors":"Guodong Song, Junwei Shi, Hang Lan, Cichen Duan, Xiang Gao, Lizheng Zhang","doi":"10.1109/CISS57580.2022.9971206","DOIUrl":null,"url":null,"abstract":"A 11-bit wideband digital true time delay (TDD) component integrated with amplifier module is proposed in this paper. The true time delay units, bi-directional amplifiers, serial-to-parallel converter and power pulse modulated circuits are integrated in a multi-chip module (MCM) with monolithic microwave integrated circuit (MMIC) and surface mount technology (SMT). Multi-layer Rogers 4350B microwave board is used to implement the routing of DC, control and RF signals, while large bit TDD is achieved through winding upon the striplines. Better flatness of time delay and high isolation can be realized by introducing cavity structures. For verification, a multi-channel wideband TDD module has been designed, fabricated and measured. According to the measured results, the TDD module achieves the receive gain within 6.5 dB ± 2 dB, transmit power within 34dBm ± 1.0 dB, and high time-delay accuracy within ± 0.5 ps for 10 ps and ± 30 ps for 3200 ps, simultaneously.","PeriodicalId":331510,"journal":{"name":"2022 3rd China International SAR Symposium (CISS)","volume":"164 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 3rd China International SAR Symposium (CISS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CISS57580.2022.9971206","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A 11-bit wideband digital true time delay (TDD) component integrated with amplifier module is proposed in this paper. The true time delay units, bi-directional amplifiers, serial-to-parallel converter and power pulse modulated circuits are integrated in a multi-chip module (MCM) with monolithic microwave integrated circuit (MMIC) and surface mount technology (SMT). Multi-layer Rogers 4350B microwave board is used to implement the routing of DC, control and RF signals, while large bit TDD is achieved through winding upon the striplines. Better flatness of time delay and high isolation can be realized by introducing cavity structures. For verification, a multi-channel wideband TDD module has been designed, fabricated and measured. According to the measured results, the TDD module achieves the receive gain within 6.5 dB ± 2 dB, transmit power within 34dBm ± 1.0 dB, and high time-delay accuracy within ± 0.5 ps for 10 ps and ± 30 ps for 3200 ps, simultaneously.