Design and simulation of AlGaN/GaN HFET

D. Nirmal, S. Varughese, D. Joy, F. Princess, P. V. Kumar
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Abstract

GaN material has a very good potential in today's semiconductor world because of its highlighted characters like wide band gap and high saturation velocity. The combined effect of piezoelectric polarization and spontaneous polarization provides a high electron concentration called 2DEG in Al0.3Ga0.7N/GaN interface which allows higher mobility of carriers in interface than in bulk GaN material. 2-D simulation of power Al0.3Ga0.7N/GaNHFET device is carried out here and the effect of different parameters are analysed and studied using Sentaurus TCAD software. Prameters like IdVg, IdVd, gmetc are obtained. Several analysis are done with source to gate length, passivation layer etc.
AlGaN/GaN HFET的设计与仿真
氮化镓材料以其宽带隙和高饱和速度等突出特点在当今半导体领域具有很好的应用前景。在Al0.3Ga0.7N/GaN界面中,压电极化和自发极化的联合作用提供了一个高电子浓度,称为2DEG,使得载流子在界面中的迁移率比块体GaN材料高。本文利用Sentaurus TCAD软件对功率Al0.3Ga0.7N/GaNHFET器件进行了二维仿真,分析研究了不同参数对器件性能的影响。得到IdVg、IdVd、gmetc等参数。对源栅长度、钝化层等进行了分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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