Life cycle assessment of an integrated circuit product

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-09 DOI:10.1109/ISEE.2001.924514

F. Taiariol, P. Fea, C. Papuzza, R. Casalino, E. Galbiati, S. Zappa

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引用次数: 48

Abstract

The use of integrated circuits (ICs) is continually increasing in any kind of industrial products and in particular in the electronic and information and communications technology products. The environmental impact related to the use and production phases of the ICs could be potentially very strong due to the high technological level of the process, the amount of energy and the special materials used for their realization. The aim of this study is to evaluate the environmental impact of an IC during its production and use phases basing on the life cycle assessment (LCA) methodology. In fact the LCA is a useful tool to quantify the environmental impact. An EPROM IC has been chosen as a representative device for its technological complexity and its large diffusion in the market. Front-end and back-end technological steps have been analyzed in detail. The energy and the fixed consumables (gases, chemicals, ...,) used in the fab have been related to the number of masks. The number of the masking steps is an indicator of process complexity, The data inventory has been obtained from detailed technological analysis, from information obtained directly from material suppliers and from the commercial database. The IC process makes large use of de-ionized water (DI). The reclaim of DI water and other materials is important in order to reduce the total environmental impact. The total inventory for a single EPROM chip has been obtained. The same approach can be extended to other types of ICs.

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集成电路产品生命周期评估

集成电路(ic)在各种工业产品中的应用不断增加，特别是在电子和信息通信技术产品中。集成电路的使用和生产阶段对环境的影响可能非常大，因为该过程的技术水平很高，需要大量的能源和用于实现集成电路的特殊材料。本研究的目的是基于生命周期评估(LCA)方法，评估集成电路在其生产和使用阶段的环境影响。事实上，LCA是量化环境影响的有用工具。EPROM集成电路由于其技术的复杂性和在市场上的广泛应用而被选为代表器件。详细分析了前端和后端技术步骤。工厂使用的能源和固定消耗品(气体，化学品，…)与口罩的数量有关。掩蔽步骤的数量是工艺复杂性的一个指标，数据清单是从详细的技术分析中获得的，从直接从材料供应商和商业数据库获得的信息中获得的。集成电路工艺大量使用去离子水(DI)。为了减少对环境的总体影响，去水和其他材料的回收是很重要的。得到了单个EPROM芯片的总库存。同样的方法可以扩展到其他类型的ic。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)

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