{"title":"Millimetre Wave Transmit and Receive Module for Broadband Mesh Networks","authors":"N. Watson, C. Caddick, T. Gokdemir, E. Bayar","doi":"10.1109/EUMA.2001.338909","DOIUrl":null,"url":null,"abstract":"The development of Mesh (multipoint to multipoint) technology for broadband wireless access networks has brought a need for high performance low cost millimeter wave transmit and receive modules (TRMs). This paper describes the design and realization of millimetric TRMs suitable for such applications. The module is based on commercially available MMICs with a number of key design features introduced as part of the manufacturing process. These features include a multilayer circuit topology which combines the DC interconnect with the RF circuit, channelisation and screening of the RF functional blocks, circuit cavities and module integration with waveguide to microstrip transitions. This paper describes the specification of the TRM results achieved and draws conclusions about the viability of low cost manufacture of such devices.","PeriodicalId":207696,"journal":{"name":"2001 31st European Microwave Conference","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 31st European Microwave Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUMA.2001.338909","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The development of Mesh (multipoint to multipoint) technology for broadband wireless access networks has brought a need for high performance low cost millimeter wave transmit and receive modules (TRMs). This paper describes the design and realization of millimetric TRMs suitable for such applications. The module is based on commercially available MMICs with a number of key design features introduced as part of the manufacturing process. These features include a multilayer circuit topology which combines the DC interconnect with the RF circuit, channelisation and screening of the RF functional blocks, circuit cavities and module integration with waveguide to microstrip transitions. This paper describes the specification of the TRM results achieved and draws conclusions about the viability of low cost manufacture of such devices.