F. Eshghabadi, Fatemeh Banitorfian, N. Noh, M. T. Mustaffa, Asrulnizam Abd Manaf
{"title":"Fully-hybrid computer-aided RF LNA design and evaluation for GSM-1900 standard band","authors":"F. Eshghabadi, Fatemeh Banitorfian, N. Noh, M. T. Mustaffa, Asrulnizam Abd Manaf","doi":"10.1109/ACQED.2015.7274030","DOIUrl":null,"url":null,"abstract":"A fully hybrid computer-aided circuit design to achieve a first-pass on-board CMOS LNA fabrication is studied. The LNA is implemented in 0.13-μm CMOS process. A post-layout die-level electromagnetic-field analysis, to extract the interconnection and interaction parasitic between on-chip components, is used. The extracted touchstone model is integrated with circuit model of board including the microstrip lines and surface-mounted passive elements as well as the electromagnetic-field extracted model of radio-frequency coaxial connectors. The hybrid electromagnetic-circuit simulation results are compared with the measurement results for evaluation. The comparison presented an excellent correlation between the simulated and measured results. The connector's effects can be de-embedded using its developed electromagnetic model. This method of simulation and optimization is targeted to achieve first-pass run instead of optimization using costly prototypes.","PeriodicalId":376857,"journal":{"name":"2015 6th Asia Symposium on Quality Electronic Design (ASQED)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 6th Asia Symposium on Quality Electronic Design (ASQED)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ACQED.2015.7274030","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A fully hybrid computer-aided circuit design to achieve a first-pass on-board CMOS LNA fabrication is studied. The LNA is implemented in 0.13-μm CMOS process. A post-layout die-level electromagnetic-field analysis, to extract the interconnection and interaction parasitic between on-chip components, is used. The extracted touchstone model is integrated with circuit model of board including the microstrip lines and surface-mounted passive elements as well as the electromagnetic-field extracted model of radio-frequency coaxial connectors. The hybrid electromagnetic-circuit simulation results are compared with the measurement results for evaluation. The comparison presented an excellent correlation between the simulated and measured results. The connector's effects can be de-embedded using its developed electromagnetic model. This method of simulation and optimization is targeted to achieve first-pass run instead of optimization using costly prototypes.