Novel Fabrication Of Electroplated 3D Micro-Coils Using 3D Photolithography Of Thick Photoresist

Abstract

ed a novel and high-yield process to fabricate electroplated 3D microI concept as shown in Figure 1, we decompose the 3D micro-coil, which integrated inductor in other words, into two parts, the bottom conductor bridges, and form the single-body air bridges during only one his does not mean the air bridges are made by the conventional way, f posts (or vias) and upper conductor lines vertically, and hence is a