Analytical Modeling of Line-Tunneling TFETs Based on Low-Bandgap Semiconductors

Bahareh Safari, S. E. Hosseini
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Abstract

The combination of two techniques: low-bandgap semiconductor and line-tunneling structure is an effective way to achieve the highest on-current in TFETs. In this paper, design of low-bandgap line-tunneling TEFT and its analytical modeling of drain current equation is proposed. The previously suggested drain current equation for the low-bandgap line-tunneling TEFT has been explained in a relatively complex form based on the minimum tunnel path that is an effective factor in determining band-to-band tunneling (BTBT). It has been simplified in this paper and reformulated based on gate-to-source voltage. Important design factors such as source doping concentration, material and thickness of the gate-insulator were examined by simulation and numerical calculations based on the minimum tunnel path for two low-bandgap In0.88Ga0.12As and relatively high-bandgap GaSb semiconductors. The comparison of the results obtained from simulations with the proposed analytical drain current model show a good agreement. Drain doping concentration, is an effective factor on the off-state current of low-bandgap TFET. This factor was examined in order to reduce the off-current.
基于低带隙半导体的线隧tfet的解析建模
低带隙半导体和线隧结构两种技术的结合是实现tfet最高导通电流的有效途径。本文提出了低带隙线隧穿TEFT的设计及其漏极电流方程的解析建模方法。先前提出的低带隙线隧穿TEFT的漏极电流方程已经以一种相对复杂的形式解释了基于最小隧道路径的漏极电流方程,而最小隧道路径是决定带到带隧穿(BTBT)的有效因素。本文对其进行了简化,并根据栅源电压进行了重新表述。基于两种低带隙In0.88Ga0.12As和高带隙GaSb半导体的最小隧道路径,通过模拟和数值计算考察了源掺杂浓度、材料和栅极绝缘子厚度等重要设计因素。仿真结果与所提出的漏极电流解析模型的结果吻合较好。漏极掺杂浓度是影响低带隙晶体管断态电流的重要因素。对该因素进行了研究,以减少断流。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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