Simulation of interchip interconnections based on resonant cavity LEDs, plastic optical fibres and CMOS interface circuits

R. Bockstaele, R. Baets
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Abstract

This paper presents a LabView-based interchip electro-optical parallel interconnect simulator. Such links are a possible solution for the interconnect bottleneck in future digital systems. The links and their characteristics are quite different from the traditional long distance optical links: the components should be small, low-cost, temperature-insensitive and simple; and the latency (the overall signal delay) and power dissipation must be kept under control. This simulator focuses in particular on the modelling of the resonant cavity LED and the performance analysis.
基于谐振腔led、塑料光纤和CMOS接口电路的片间互连仿真
本文提出了一种基于labview的芯片间光电并行互连模拟器。这种链路是未来数字系统互连瓶颈的可能解决方案。这种链路及其特点与传统的长距离光链路有很大的不同:元件要小、成本低、对温度不敏感、结构简单;延迟(整体信号延迟)和功耗必须保持在控制之下。该模拟器着重于谐振腔LED的建模和性能分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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