PCB-package to chip wireless power transfer scheme using magnetic-field resonance coupling for high-density 3-D IC

Abstract

In this paper, we propose and demonstrate a chip-level wireless power transfer (WPT) interconnection scheme to reduce power supply interconnections for high-density 3-dimensional integrated circuits (3-D ICs). We fabricated an active chip to design a receiver coil, full-bridge rectifier and DC/DC converter to get DC power from wirelessly delivered AC power from a printed circuit board (PCB) package using the 0.18 μm SK-Hynix CMOS process. The fabricated chip is attached on the transmitter PCB-package with coil-to-coil center alignment for experimental demonstration. An equivalent circuit model of the proposed chip-level WPT interconnection scheme is suggested with analytic equations, and voltage transfer ratio and power transfer efficiency are estimated from the model. The proposed model is verified by comparing Z-parameter results obtained from 3-D EM simulation and measurement of the fabricated test vehicle from 10 MHz to 5 GHz. The voltage transfer ratio and power transfer efficiency of the designed package-to-chip WPT including a 3.3 ohm source resistance is able to reach 0.76 V/V and 34 %, respectively.