Development of Compact Coupler Devices on Microstrip Structures with Different Substrate Thicknesses

Abstract

In this work compact branch-line coupler with the use of microstrip U -shaped containers with different thicknesses of the substrate used are developed. With the help of a specialized program, an assessment was made of how much the change in such a substrate parameter as the thickness of the possibility of miniaturization affects coupler. Miniaturization of the area of devices was realized due to reduction of dimensions with the help of equivalent circuits in the form of a high-resistance line and connected to it in parallel with U-shaped capacitance. The characteristics of this circuit have similar characteristics in the frequency band with the characteristics of the segments used in the standard scheme. Let's consider three variants of designs of power dividers with different substrate thicknesses from 1 to 2 mm, with a step of half a millimeter. Proceeding from this, it was found that when the thickness of the substrate is reduced, the possibilities to reduce the dimensions of the device are increased.