Analysis of the Possibilities of Creating Embedded Vias’ Based on Different Solder Alloys

Abstract

This paper is focused on the possibilities of embedded vias’ creating based on different solder alloys. Tested samples consist of two double-sided printed circuit boards and the laminate’s core without copper laminated between them. The purpose of this research was to establish the cost-effective, less technologically demanding, and embedded components’ technologies compatible via connections, which could remove chemically based technological steps. Realized embedded vias have a diameter of 700 μm. Embedded vias were analyzed based on electrical properties as well as cross section method. There were three solder pastes with a different melting point used for this experiment. Solder pastes are an inseparable part of the multilayer PCBs but embedding the solder pastes into the substrate brings other technological challenges. This research shows that solder balls represent the more effective and stable possibility for the realization of the embedded vias. Embedded vias based on Sn96.5Ag3Cu0.5 solder balls have shown stable properties after multiple reflow processes.