Improved stochastic dissimilar diffusion bonding model with experimental validation

Bryan Ferguson, Neha Kulkarni, D. G. Sanders, E. Bol, M. Ramulu
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Abstract

Abstract. Diffusion bonding is a solid-state welding operation that has seen wide spread use in the aerospace industry, especially in combination with superplastic forming. It combines two relatively flat, clean surfaces at high temperature to create a near flawless weld over a large surface area. Modelling of diffusion bonding has been challenging due in part because of the larger variations in voids formed from the mating surfaces. This paper attempts to compensate for that inadequacy by implementing a stochastic diffusion bonding model based with theoretical voids formed from interacting surfaces. The model uses a statistical version of Pilling’s model in combination with surface roughness based initial conditions that estimates the possibilities of voids formed. The results of the model are compared with experimental results for three different alloys at a variety of process conditions along with presenting an investigation of the mechanics of the model for future improvements.
改进的随机异种扩散键合模型,并进行了实验验证
摘要扩散连接是一种固态焊接操作,在航空航天工业中广泛应用,特别是与超塑性成形相结合。它将两个相对平坦、干净的表面在高温下结合在一起,在很大的表面上创造出近乎完美的焊缝。扩散键合的建模一直具有挑战性,部分原因是由配合表面形成的空隙变化较大。本文试图通过实现基于相互作用表面形成的理论空洞的随机扩散键合模型来弥补这一不足。该模型使用了Pilling模型的统计版本,并结合了基于表面粗糙度的初始条件,以估计形成空洞的可能性。将模型的结果与三种不同合金在不同工艺条件下的实验结果进行了比较,并对模型的力学特性进行了研究,以供今后改进。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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