Comparison of hot-carrier effects in deep submicron N- and P-channel partially- and fully-depleted Unibond and SIMOX MOSFETs

S. Renn, C. Raynaud, J. Pelloie, F. Balestra
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引用次数: 8

Abstract

A thorough investigation on hot-carrier effects in deep submicron N- and P-channel SOI MOSFETs is reported in this paper. The following studies are presented in order to thoroughly assess the reliability of SOI technologies: (i) comparison of hot-carrier effects in SIMOX and Unibond MOSFETs; (ii) evaluation of the hot-carrier immunity of fully and partially depleted devices; (iii) analysis of the degradation in N- and P-channel transistors; and (iv) investigation of the aging/recovery mechanisms.
深亚微米N和p沟道部分耗尽和完全耗尽单键和SIMOX mosfet中热载子效应的比较
本文对深亚微米N沟道和p沟道SOI mosfet中的热载子效应进行了深入研究。为了全面评估SOI技术的可靠性,提出了以下研究:(i)比较SIMOX和单键mosfet中的热载子效应;(ii)评估完全耗尽和部分耗尽设备的热载流子抗扰度;(iii) N沟道和p沟道晶体管的退化分析;(四)衰老/恢复机制的研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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