Reduced order thermal models for electronic devices

Abstract

In this paper, a novel method to determine from experimental observations the thermal models of integrated devices is presented. In particular, we focus on experimental data providing the temperature distribution over the device surface and determine a model in which the spatial diffusion of heat loads is explicitly taken into account and modeled. The adoption of this approach leads to the possibility to sensibly reduce the order of complete thermal model, with respect to classical approaches, even considering numerically generated datasets.