Silicon katarometer with the BSC-type contacts

Jan M. Lysko, Joanna Lozinko, J. Jaźwiński, B. Latecki, A. Panas, M. Górska
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Abstract

Thermal conductivity detector (TCD, katarometer) silicon chip was designed with the BSC type (Back Side Contact) electrical contacts, covered by the Cr/Au layer. Detector consists of the two elements - glass plate and silicon chip. There are two flow channels formed at the glass-silicon interface - one for detection and the other for reference. Two highly symmetrical groups of resistors were aligned with the channels and, in the last stage of the fabrication sequence, released from the silicon substrate. Some of these resistors act as the heaters, the other ones as the detectors (thermoresistors) to detect changes of the flowing gas temperature. Tubing - gas inlets and outlets - was positioned at the detector edge, in the Si-glass interface plane. BSC-type electrical contacts application enabled very convenient bonding pads location. The Contacts formation process was optimized and integrated with the other technological steps.
带有bsc型触点的硅变形计
热导率检测器(TCD, katarometer)硅芯片采用BSC型(Back Side Contact)电触点,覆盖Cr/Au层。探测器由玻璃板和硅片两部分组成。在玻璃-硅界面处形成两条流动通道,一条用于检测,另一条用于参考。两个高度对称的电阻器组与通道对齐,并在制造序列的最后阶段从硅衬底释放。这些电阻中的一些作为加热器,其他的作为检测器(热敏电阻)来检测流动气体温度的变化。油管-气体入口和出口-位于探测器边缘,在硅玻璃界面平面上。bsc型电触点应用使得非常方便的连接焊盘位置。对触点成型工艺进行了优化,并与其他工艺步骤相结合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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