Substrate Integrated Waveguide Diplexer Design

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Abstract

This chapter implements the microwave diplexer circuit model established in Chapter 4, using the twenty-first substrate integrated waveguide transmission line technology. No separate junction (resonant or non-resonant) was utilised in achieving the diplexer, as the use of an external junction for energy distribution in a diplexer normally increases design complexity and lead to a bulky device. The design also featured a novel input/output coupling technique at the transmit and the receive sides of the diplexer. The proposed SIW diplexer has been simulated using the full-wave finite element method (FEM), Keysight electromagnetic professional (EMPro) 3D simulator. The design has also been validated experimentally and results presented. Simulated and measured results show good agreement. The measured minimum insertion loss achieved on the transmit and the receive channels of the diplexer are 2.86 dB and 2.91 dB, respectively. The measured band isolation between the two channels is better than 50 dB.
衬底集成波导双工器设计
本章采用第21衬底集成波导传输线技术,实现了第4章建立的微波双工器电路模型。在实现双工器时没有使用单独的结(谐振或非谐振),因为在双工器中使用外部结进行能量分配通常会增加设计复杂性并导致设备体积庞大。该设计还在双工器的发射和接收端采用了新颖的输入/输出耦合技术。采用全波有限元法(FEM)和Keysight电磁专业(EMPro)三维模拟器对所提出的SIW双工器进行了仿真。实验验证了设计的正确性,并给出了实验结果。仿真结果与实测结果吻合良好。在双工器的发射和接收信道上测量到的最小插入损耗分别为2.86 dB和2.91 dB。测得两通道间的频带隔离度优于50 dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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