Applications of closed-form wiring escape formulae to a high performance printed wiring board

T. Zhou, G. Katopis
{"title":"Applications of closed-form wiring escape formulae to a high performance printed wiring board","authors":"T. Zhou, G. Katopis","doi":"10.1109/EPEP.2003.1250037","DOIUrl":null,"url":null,"abstract":"Closed-form formulae are derived for wiring escape from an area array to the standard horizontal ground rules of the package level under consideration. The required layer counts for successful escape based on two strategies are given in this paper. The effects of lines per channel, extra channels at the edges of an area array, different via technologies, and signal pin depopulation are considered in the derivations. The resulting closed-form formulae are also used to a high performance printed wiring board for the estimation of the layers needed. The estimation of the layer count from our formulae agrees with the one achieved empirically in the actual design.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250037","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

Closed-form formulae are derived for wiring escape from an area array to the standard horizontal ground rules of the package level under consideration. The required layer counts for successful escape based on two strategies are given in this paper. The effects of lines per channel, extra channels at the edges of an area array, different via technologies, and signal pin depopulation are considered in the derivations. The resulting closed-form formulae are also used to a high performance printed wiring board for the estimation of the layers needed. The estimation of the layer count from our formulae agrees with the one achieved empirically in the actual design.
闭式放线公式在高性能印制板上的应用
导出了从区域阵列到所考虑的封装层的标准水平接地规则的布线逃逸的封闭形式公式。本文给出了基于两种策略的成功逃逸所需的层数。在推导中考虑了每个通道的线路、区域阵列边缘的额外通道、不同的通孔技术和信号引脚减少的影响。所得到的封闭公式也用于高性能印刷线路板的层数估算。从公式中估计的层数与实际设计中的经验值一致。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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