Device-to-circuit interactions in SiGe technology: Challenges and opportunities

J. Cressler
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引用次数: 8

Abstract

The tight coupling between the nuanced physics of silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs) and the circuits in which they are utilized in many ways represents the “final frontier” for research in technology optimization, device physics, compact modeling, circuit design, and system implementations. As relevant examples of the inherent complexities associated with such “device-to-circuit interactions” within the SiGe world, I examine two distinct scenarios: 1) Our ability to accurately predict the end-of-life reliability of actual SiGe HBT circuits; and 2) Our ability to mitigate transient radiation effects in SiGe HBT circuits. In each example, I address the scope of the problem, the challenges faced in trying to solve them, and the opportunities presented if and when that success comes.
SiGe技术中的器件与电路交互:挑战与机遇
硅锗(SiGe)异质结双极晶体管(HBTs)的细微物理特性与它们在许多方面的应用电路之间的紧密耦合代表了技术优化、器件物理、紧凑建模、电路设计和系统实现研究的“最终前沿”。作为SiGe世界中与这种“设备与电路相互作用”相关的固有复杂性的相关示例,我检查了两个不同的场景:1)我们准确预测实际SiGe HBT电路的寿命终止可靠性的能力;2)我们在SiGe HBT电路中减轻瞬态辐射效应的能力。在每一个例子中,我都阐述了问题的范围、解决问题时所面临的挑战,以及当成功到来时所带来的机遇。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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