Design and implementation of an illumination device for optical inspection of defects in glass substrates

Ming-Fu Chen, B. Chen, Chih-Wen Chen, Rui-Cian Weng, Ming Chang
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引用次数: 2

Abstract

A compact and cost-effective illumination platform was developed for a versatile optical inspection system to improve the detection accuracy of defects in glass substrates. The illumination device was developed in two phases, initially to demonstrate its feasibility for surface defect inspection in glass based on dark field images, and subsequently to optimize the design so it can provide multi-directional lighting and increase light scattering from defects on the substrate. Three LED arrays were installed above the substrate carrier and projected at an angle onto the glass substrate for the phase-I illumination device. Surface defects on the glass substrate were successfully reconstructed from images acquired by a line scanned CCD camera, but non-uniformity of defects intensity distribution on images was revealed. To optimize the illumination, two sets of tightly arrayed 3-watt LEDs were symmetrically installed at the entrance slit of the lens-camera module for phase-II illumination device. The inspection data were able to show clearer images of surface defects. The design issues such as poor contrast and sharpness of acquired images due to low scattering efficiency and non-uniform illumination were addressed as well. PCBs for the installation of the LED arrays and their power supply were also optimized. These were manufactured on aluminum substrate to help regulate heating of the inspection platform. This feature makes the system more compact, operable at low power, and easy for modification.
一种用于光学检查玻璃基板缺陷的照明装置的设计和实现
为提高玻璃基板缺陷的检测精度,研制了一种紧凑、经济的多功能光学检测系统照明平台。该照明装置的开发分为两个阶段,首先是为了证明其基于暗场图像检测玻璃表面缺陷的可行性,随后是为了优化设计,使其能够提供多向照明,并增加基板上缺陷的光散射。三个LED阵列安装在衬底载体上方,并以一定角度投射到玻璃衬底上,用于i相照明装置。利用线扫描CCD相机获得的图像成功地重建了玻璃基板表面缺陷,但发现缺陷强度在图像上的分布不均匀。为了优化照明效果,将两组紧密排列的3瓦led对称安装在ii期照明装置的镜头-相机模组的入口狭缝处。检测数据能够显示更清晰的表面缺陷图像。解决了由于散射效率低、光照不均匀等原因导致采集图像对比度和清晰度差的设计问题。同时对LED阵列安装用pcb及其电源进行了优化。这些是在铝基板上制造的,以帮助调节检测平台的加热。这一特点使系统更紧凑,低功耗操作,易于修改。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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