456Gbps High-speed Ceramic Package Applied to Optical Communication

Abstract

A high-speed ceramic package based on High-temperature cofired ceramics (HTCC) process is presented in this paper. The traditional differential vias structure is replaced by face via structure at the signal transmission port. By analyzing its equivalent circuit model and simulating in frequency domain, the port can realize single channel high-speed signal transmission with 40GHz bandwidth on the premise of ensuring signal integrity. The cylinder via structure and face via structure under the same conditions are analyzed in frequency domain and time domain. It is verified that the face via structure has better transmission characteristics and can more effectively ensure the signal integrity. Finally, the structure is applied to the four-channel package of Optical module, which can support high-speed signal transmission above 4 × 56Gbps.