Characterization of transmission lines in a novel high-frequency laminate

Abstract

In this work a method for characterization of transmission line (TL) in high-frequency laminates is proposed. The method is performed in a novel PCB laminate based in PTFE for high-frequency applications with low conductor roughness (hrms) and low loss tangent (tanδ). In order to apply the characterization method, S-parameters were taken up to 30 GHz in a microstrip interconnect. Time domain simulation was performed to validate the model, showing good agreement with experimental results.