Electric thermal coupling field calculation of GIS conductor joint

Abstract

Various types of electrical connectors in GIS play a decisive role in the withstand voltage performance, normal load current capacity, short-circuit current tolerance and overall reliability of GIS. In order to study the electric thermal coupling field characteristics of the conductor joint under the contact finger connection mode, a three-dimensional electromagnetic heat flow coupling model of 220kV GIS conductor joint is established in this paper. The finite element analysis method is used to simulate and calculate the steady-state temperature field distribution by using COMSOL multiphysics and ANSYS-CFX, and the electric field distribution when the material performance parameters change under the influence of temperature is calculated. In addition, considering that the contact finger is affected by external factors, resulting in contact deterioration, this paper calculates the temperature field and electric field distribution of GIS conductor joint under different degrees of contact deterioration. The results show that the increase of contact resistance will cause a certain temperature rise of GIS conductor joint, and then affect the overall electric field distribution. This paper can provide a reference for the research on the heating of conductor joints in engineering.