Glass interposer integrated millimeter wave antennas for inter-/intra chip communications

Abstract

Millimeter wave antennas are integrated in the glass interposer layer for wireless inter-/intra chip/board communications. For in-plane communication, a disc loaded monopole antenna with an omni-directional radiation pattern is designed while for out-of plane communication, a similar architecture with patch mode radiation is configured. These antennas are useful for wireless interconnects in three dimensional integrated systems in package.