High-temperature performance of SOI and bulk-silicon RESURF LDMOS transistors

E. Arnold, T. Letavic, S. Merchant, H. Bhimnathwala
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引用次数: 18

Abstract

High-temperature off-state and on-state characteristics of bulk-Si and thin-SOI RESURF LDMOS transistors were studied experimentally and theoretically. The off-state leakage current in the SOI devices was only 1.5 nA//spl mu/m at 300/spl deg/C. The increase of on-resistance with temperature in the SOI devices is smaller than in the bulk-Si devices because of the heavier doping dictated by the RESURF principle. The reverse recovery time of the SOI device shows only slight temperature dependence. The results of this study indicate that LDMOS transistors fabricated in thin SOI layers are well suited for high-temperature power IC applications.
SOI和大块硅重熔LDMOS晶体管的高温性能
从实验和理论两方面研究了大块硅和薄soi重熔LDMOS晶体管的高温开、关态特性。在300/spl度/C时,SOI器件的断态泄漏电流仅为1.5 nA//spl mu/m。SOI器件的导通电阻随温度的增加比块硅器件的小,这是因为由RESURF原理决定的更重的掺杂。SOI器件的反向恢复时间仅表现出轻微的温度依赖性。本研究结果表明,在薄SOI层中制造的LDMOS晶体管非常适合于高温功率集成电路应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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