Performance Analysis of Enhancement Mode Composite Channel MOSHEMT Device for Low Power Applications

R. S. Kumar, P. Anand, S. Karthick, R. N. Kumar, R. Poornachandran, N. Kumar
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Abstract

High Electron Mobility Transistor (HEMT) is currently playing a major role in electronics industries for low and high-power applications along with high frequency operations. In this paper, simulation of single gate enhancement mode InAs based composite channel MOSHEMT devices is performed for low power applications leading to the superior analog and RF performances. This performance is achieved by focusing the work towards the lattice matched composite channel, a recessed gate structure, HfO2 gate dielectric, and optimized source to drain spacing. The device performance characteristics are systematically analyzed with the optimized device dimensions of gate length (LG) = 50 nm, Barrier thickness (TB) = 3 nm, channel thickness (TCH) = 15 nm for the various gate to drain spacing. The reduction of a gate to drain spacing helps in minimizing the drain resistance and increased electron velocity. This effects in improving the transconductance (gm), drain current (ID), cutoff frequency (ft) along with the expense of short channel effects.
低功耗增强模式复合通道MOSHEMT器件性能分析
高电子迁移率晶体管(HEMT)目前在电子工业的低功率和高功率应用以及高频操作中发挥着重要作用。在本文中,对基于单栅极增强模式InAs的复合通道MOSHEMT器件进行了低功耗应用仿真,从而获得了卓越的模拟和射频性能。这种性能是通过将工作集中在晶格匹配的复合通道、凹槽栅极结构、HfO2栅极电介质和优化的源漏间距上实现的。在不同栅极漏极间距下,以栅极长度(LG) = 50 nm、势垒厚度(TB) = 3 nm、沟道厚度(TCH) = 15 nm为优化尺寸,系统分析了器件的性能特性。栅极漏极间距的减小有助于减小漏极电阻和增加电子速度。这在改善跨导(gm),漏极电流(ID),截止频率(ft)以及短通道效应的费用方面起作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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