Design and Validation of an Automation Strategy for the Strip Test Process in the Semiconductor Industry

M. A. A. Rahman, Cheng-Yi Lin, Paul G. Maropoulus, Woei Sheng Teoh, Azrul Azwan Abdul Rahman, E. Mohamad
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Abstract

The semiconductor devices may be individually tested or tested in a batch process. One type of batch process is strip testing. Strip testing is the electrical testing of a semiconductor while the device is still in the lead frame strip. Strip test offers the most cost savings for small devices and short test times. Despite their advantages, current strip testing is not a fully optimized solution. During the lot change, the operator must perform a series of system-to-physical validation and several steps of system tracking before the lot starts. Various manual activities are happening within the process, consuming many productivity issues. On top of that, human intervention during the process will increase the possibility of the quality issue. The research aims to investigate the current tasks during the strip test process. It also aimed to develop and validate a suitable automation strategy for the trip test process. The work starts with a detailed study of the current process, transaction, and hardware. Later a potential improvement using automation is proposed to replace the operator's repetitive job and simultaneously be fully integrated with the manufacturing execution system. This research is hoped to bring a significant contribution and readiness for the next level of automation in semiconductor manufacturing, especially in strip testing. Through automation functionality, this preliminary work shows an increase in productivity and quality upon implementation.
半导体工业条带测试过程自动化策略的设计与验证
所述半导体器件可以单独测试或在批处理中测试。批处理的一种方法是试纸。条带测试是当器件仍在引线框架条带中时对半导体进行的电气测试。条带测试为小型设备和较短的测试时间节省了最大的成本。尽管有这些优点,但目前的条带测试并不是一个完全优化的解决方案。在批次变更期间,操作人员必须在批次开始之前执行一系列系统到物理验证和几个系统跟踪步骤。流程中发生了各种手工活动,消耗了许多生产力问题。最重要的是,在这个过程中,人为干预会增加质量问题的可能性。本研究旨在探讨试纸过程中的当前任务。它还旨在为起下钻测试过程开发和验证合适的自动化策略。工作开始于对当前进程、事务和硬件的详细研究。随后提出了使用自动化的潜在改进,以取代操作员的重复性工作,同时与制造执行系统完全集成。这项研究有望为半导体制造自动化的下一个阶段,特别是在条带测试方面做出重大贡献和准备。通过自动化功能,这项初步工作显示了实现后生产力和质量的提高。
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