Characterization of 8T SRAM cells using 16 nm FinFET technology

M. M, P. Chandramohan
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引用次数: 6

Abstract

SRAMs are faster and more reliable which are often used as memory cache in digital processors for high speed operation. Conventional 6T SRAM cell suffers from access transistor sizing conflict resulting in a trade-off between read stability and write ability. This paper presents the characterization of four 8T SRAM cell structures - Conventional 8T SRAM cell, Single Ended 8T SRAM cell, 8T SRAM cell using two conducting p-type transistors and 8T SRAM cell using transmission gate between the cross-coupled inverters using 16 nm FinFET technology at a supply voltage 0.85 V. The stability performance parameters RSNM and WSNM are analyzed. HSPICE simulation results show that FinFET based SRAM designs provide better performance compared to CMOS based SRAM designs at technology nodes below 32 nm. Conventional 8T SRAM cell provides better RSNM and WSNM of 261.81 mV and 273.58 mV compared to the other structures which either degrade RSNM or WSNM or depend on proper transistor sizing for successful operation of the SRAM cell.
使用16nm FinFET技术表征8T SRAM电池
sram速度更快,更可靠,通常用作数字处理器的高速运行内存缓存。传统的6T SRAM单元遭受访问晶体管尺寸冲突,导致读取稳定性和写入能力之间的权衡。本文介绍了四种8T SRAM电池结构的特性-传统8T SRAM电池,单端8T SRAM电池,使用两个导电p型晶体管的8T SRAM电池和在0.85 V电源电压下使用16 nm FinFET技术的交叉耦合逆变器之间使用传输栅极的8T SRAM电池。分析了稳定性能参数RSNM和WSNM。HSPICE仿真结果表明,在32nm以下的技术节点上,基于FinFET的SRAM设计比基于CMOS的SRAM设计提供了更好的性能。传统的8T SRAM单元提供了更好的RSNM和WSNM,分别为261.81 mV和273.58 mV,而其他结构要么降低RSNM或WSNM,要么依赖于适当的晶体管尺寸来成功运行SRAM单元。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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